CVE-2017-18297 (sd_425_firmware, sd_430_firmware, sd_450_firmware, sd_625_firmware, sd_650_firmware, sd_652_firmware, sd_820_firmware)
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Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.
https://web.nvd.nist.gov/view/vuln/detail?vulnId=CVE-2017-18297
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